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path: root/drivers/interconnect/qcom/Kconfig
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2026-09-16Merge branch 'icc-kuno' into icc-nextGeorgi Djakov
Add interconnect (NoC) provider driver for the Qualcomm Kuno SoC. * icc-kuno dt-bindings: interconnect: Add Qualcomm Kuno NoC interconnect: qcom: Add Kuno interconnect provider driver Link: https://patch.msgid.link/20260827-kuno-soc-support-v5-0-6d47636a8f09@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-09-09interconnect: qcom: Add Kuno interconnect provider driverHardeep Sharma
Add the interconnect provider driver for the Qualcomm Kuno SoC to enable bus bandwidth voting on the platform. This includes the aggre-noc and cnoc-main NoC instances with their associated BCM nodes. Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Signed-off-by: Hardeep Sharma <hardeep.sharma@oss.qualcomm.com> Reviewed-by: Abel Vesa <abel.vesa@oss.qualcomm.com> Link: https://patch.msgid.link/20260827-kuno-soc-support-v5-7-6d47636a8f09@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-09-08interconnect: qcom: Add missing depends to Hawi, Maili, Nord and ShikraKrzysztof Kozlowski
Hawi, Maili, Nord and Shikra were added in parallel or after commit 5b696f065843 ("interconnect: qcom: Restrict drivers per ARM/ARM64"), thus they missed the update restricting them per architecture (with the same rationale). Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Link: https://patch.msgid.link/20260720-interconnect-qcom-clean-arm64-v3-2-942e8ee7ebda@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-09-08interconnect: qcom: Make important drivers defaultKrzysztof Kozlowski
The interconnect drivers for Qualcomm SoC Network-on-Chip are covering a basic or fundamental SoC feature: bandwidth management between internal SoC blocks. SoC can boot without these, but power management or performance will be affected. These drivers do not represent any sort of buses visible to the board designers/configurators, thus they should be always enabled, regardless how SoC is used in the final board. Kernel configuration should not ask users choice of drivers when that choice is obvious and known to the developers that answer should be 'yes' or 'module'. Switch all almost Qualcomm interconnect drivers to a default 'yes' for ARCH_QCOM. This has impact: 1. arm64 defconfig: a. Enable as built-in INTERCONNECT_QCOM_HAWI, INTERCONNECT_QCOM_NORD, INTERCONNECT_QCOM_SDM660, INTERCONNECT_QCOM_SDM670, INTERCONNECT_QCOM_SM7150 and INTERCONNECT_QCOM_SAR2130P, which were not selected before but should be, because these platforms need them anyway for proper functioning. b. Switch to built-in from a module INTERCONNECT_QCOM_QCS404 and INTERCONNECT_QCOM_MSM8916, which as modules would not make the platform bootable in most cases, and INTERCONNECT_QCOM_OSM_L3, which when module might slow down boot considerably by having caches running at slow speed. 2. arm qcom_defconfig: Switch to built-in from a module INTERCONNECT_QCOM_RPMH, INTERCONNECT_QCOM_SMD_RPM, INTERCONNECT_QCOM_BCM_VOTER, INTERCONNECT_QCOM_MSM8974, INTERCONNECT_QCOM_SDX55, which as modules would not make the platform bootable in most cases. 3. arm multi_v7 defconfig: Enable drivers necessary to boot ARM 32-bit platforms, which are already enabled on qcom_defconfig: a. Enable as built-in INTERCONNECT_QCOM_MSM8974. b. Enable as modules (other dependencies prevent from built-in) INTERCONNECT_QCOM_RPMH, INTERCONNECT_QCOM_BCM_VOTER and INTERCONNECT_QCOM_SDX55. 4. COMPILE_TEST builds: Enable by default all drivers for arm or arm64 builds, whenever ARCH_QCOM is selected. This has impact on build time and feels logical, because if one selects ARCH_QCOM then probably by default wants to build test it entirely. Kernels with COMPILE_TEST are not supposed to be used for booting. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Link: https://patch.msgid.link/20260720-interconnect-qcom-clean-arm64-v3-1-942e8ee7ebda@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-09-08interconnect: qcom: Enable Shikra interconnect driver by default for ARCH_QCOMRaviteja Laggyshetty
Interconnect drivers provide fundamental NoC bandwidth management required for correct system behavior. Although systems can boot without them, power and performance are impacted. These drivers need to enabled irresepective of the board variant, design or configuration. Enable the Shikra interconnect driver by default on ARCH_QCOM by setting "default ARCH_QCOM". Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Link: https://patch.msgid.link/20260526-shikra_icc_kconfig-v1-1-c589db2d023c@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-07-22Merge branch 'icc-misc' into icc-nextGeorgi Djakov
* icc-misc interconnect: qcom: add COMPILE_TEST interconnect: qcom: simplify allocation interconnect: debugfs-client: add NULL check for platform_device_alloc interconnect: Fix use after free in icc_get() and of_icc_get_by_index() Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-07-22interconnect: qcom: add COMPILE_TESTRosen Penev
Allow non-ARM to build this. Signed-off-by: Rosen Penev <rosenp@gmail.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@oss.qualcomm.com> Link: https://patch.msgid.link/20260608050542.6167-1-rosenp@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-07-07interconnect: qcom: add Maili interconnect provider driverRaviteja Laggyshetty
Add driver for the Qualcomm interconnect buses found in Maili based platforms. The topology consists of several NoCs that are controlled by a remote processor that collects the aggregated bandwidth for each master-slave pairs. Co-developed-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Signed-off-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Link: https://patch.msgid.link/20260622-maili_icc-v2-2-18b5ac08c04f@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-05-22Merge branch 'icc-misc' into icc-nextGeorgi Djakov
* icc-misc interconnect: Do not create empty devres on missing interconnects interconnect: Move MODULE_DEVICE_TABLE next to the table itself dt-bindings: interconnect: qcom,sdm660: Disallow clocks when appropriate dt-bindings: interconnect: qcom,sm6115: Drop incorrect children if:then: block dt-bindings: interconnect: qcom,sm6115: Restrict children and clocks interconnect: qcom: Fix indentation interconnect: qcom: Restrict drivers per ARM/ARM64 Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-05-21Merge branch 'icc-hawi' into icc-nextGeorgi Djakov
Add interconnect bindings and RPMh-based interconnect driver support for the upcoming Qualcomm Hawi SoC. * icc-hawi dt-bindings: interconnect: qcom-bwmon: Add Hawi cpu-bwmon compatible dt-bindings: interconnect: qcom-bwmon: Add Hawi llcc-bwmon compatible dt-bindings: interconnect: qcom: document the RPMh NoC for Hawi SoC interconnect: qcom: add Hawi interconnect provider driver Link: https://patch.msgid.link/20260506-icc-hawi-v4-0-35447fdc482b@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-05-21interconnect: qcom: add Hawi interconnect provider driverVivek Aknurwar
Add driver for the Qualcomm interconnect buses found in Hawi based platforms. The topology consists of several NoCs that are controlled by a remote processor that collects the aggregated bandwidth for each master-slave pair. Reviewed-by: Mike Tipton <mike.tipton@oss.qualcomm.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@oss.qualcomm.com> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Signed-off-by: Vivek Aknurwar <vivek.aknurwar@oss.qualcomm.com> Link: https://patch.msgid.link/20260506-icc-hawi-v4-2-35447fdc482b@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-05-21Merge branch 'icc-nord' into icc-nextGeorgi Djakov
This adds RPMh-based interconnect support for the Qualcomm Nord SoC. The Nord SoC features a rich Network-on-Chip topology comprising 19 NoCs including aggregate NoCs, a high-speed configuration NoC (HSCNOC), a multimedia NoC, four NSP data NoCs for AI/ML workloads, PCIe inbound and outbound NoCs, a system NoC, and virtual clock/MC nodes. Bandwidth requests are communicated to the RPMh hardware through Bus Clock Manager (BCM) resources via the Resource State Coordinator (RSC). * icc-nord dt-bindings: interconnect: Document RPMh Network-On-Chip for Qualcomm Nord SoC interconnect: qcom: Add interconnect provider driver for Nord SoC Link: https://patch.msgid.link/20260510020607.1129773-1-shengchao.guo@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-05-10interconnect: qcom: Restrict drivers per ARM/ARM64Krzysztof Kozlowski
There is no point to allow selecting core SoC drivers like interconnects for Qualcomm ARMv7 SoCs when building ARM64 kernel, and vice versa. This makes kernel configuration more difficult as many do not remember the Qualcomm SoCs model names/numbers and their properties like architecture. No features should be lost because: 1. There won't be a single image for ARMv7 and ARMv8/9 SoCs. 2. Newer ARMv8/9 SoCs won't be running in arm32 emulation mode. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Link: https://patch.msgid.link/20260428-interconnect-qcom-clean-arm64-v1-2-e6bc3f7832db@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-05-10interconnect: qcom: Fix indentationKrzysztof Kozlowski
KConfig entries should be indented starting with one tab, so replace spaces with it. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Link: https://patch.msgid.link/20260428-interconnect-qcom-clean-arm64-v1-1-e6bc3f7832db@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-05-10interconnect: qcom: Add interconnect provider driver for Nord SoCOdelu Kukatla
Add driver for the Qualcomm interconnect buses found on Nord SoC. The topology consists of several NoCs that are controlled by a remote processor that collects the aggregated bandwidth for each master-slave pair. Signed-off-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@oss.qualcomm.com> Signed-off-by: Shawn Guo <shengchao.guo@oss.qualcomm.com> Link: https://patch.msgid.link/20260510020607.1129773-3-shengchao.guo@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-05-10interconnect: qcom: add Shikra interconnect provider driverRaviteja Laggyshetty
Add driver for the Qualcomm interconnect buses found in Shikra based platforms. The topology consists of several NoCs that are controlled by a remote processor that collects the aggregated bandwidth for each master-slave pairs. Co-developed-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Signed-off-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@oss.qualcomm.com> Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com> Link: https://patch.msgid.link/20260505-shikra_icc-v3-2-8e03ff27c007@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-03-06Merge branch 'icc-eliza' into icc-nextGeorgi Djakov
Add interconnect support for the Qualcomm Eliza SoC. * icc-eliza dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in Eliza SoC interconnect: qcom: Add Eliza interconnect provider driver dt-bindings: interconnect: OSM L3: Add Eliza EPSS L3 compatible Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-03-06interconnect: qcom: Add Eliza interconnect provider driverOdelu Kukatla
Add driver for the Qualcomm interconnect buses found in Eliza based platforms. The topology consists of several NoCs that are controlled by a remote processor that collects the aggregated bandwidth for each master-slave pairs. Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@oss.qualcomm.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Signed-off-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Signed-off-by: Abel Vesa <abel.vesa@oss.qualcomm.com> Link: https://msgid.link/20260224-eliza-interconnect-v4-2-ad75855d5018@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2026-03-06interconnect: qcom: De-acronymize SoC namesKrzysztof Kozlowski
Glymur and Kaanapali are codenames of Qualcomm SoCs, not acronyms. Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@oss.qualcomm.com> Link: https://msgid.link/20260217130035.281752-4-krzysztof.kozlowski@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-10-31interconnect: qcom: add Kaanapali interconnect provider driverRaviteja Laggyshetty
Add driver for the Qualcomm interconnect buses found in Kaanapali based platforms. The topology consists of several NoCs that are controlled by a remote processor that collects the aggregated bandwidth for each master-slave pairs. Co-developed-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Signed-off-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@oss.qualcomm.com> Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com> Link: https://lore.kernel.org/r/20251031-knp-interconnect-v4-2-568bba2cb3e5@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-08-18interconnect: qcom: add glymur interconnect provider driverRaviteja Laggyshetty
Add driver for the Qualcomm interconnect buses found in glymur based platforms. The topology consists of several NoCs that are controlled by a remote processor that collects the aggregated bandwidth for each master-slave pairs. Co-developed-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Signed-off-by: Odelu Kukatla <odelu.kukatla@oss.qualcomm.com> Signed-off-by: Raviteja Laggyshetty <raviteja.laggyshetty@oss.qualcomm.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@oss.qualcomm.com> Link: https://lore.kernel.org/r/20250814-glymur-icc-v2-3-596cca6b6015@oss.qualcomm.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2025-07-22interconnect: qcom: Add Milos interconnect provider driverLuca Weiss
Add driver for the Qualcomm interconnect buses found in Milos based platforms. The topology consists of several NoCs that are controlled by a remote processor that collects the aggregated bandwidth for each master-slave pairs. Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Link: https://lore.kernel.org/r/20250709-sm7635-icc-v3-2-c446203c3b3a@fairphone.com [georgi: remove null termination of nodes and links] Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-12-17interconnect: qcom: Add interconnect provider driver for SM8750Raviteja Laggyshetty
Introduce SM8750 interconnect provider driver using the interconnect framework. Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com> Signed-off-by: Melody Olvera <quic_molvera@quicinc.com> Reviewed-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20241204-sm8750_master_interconnects-v3-2-3d9aad4200e9@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-11-05Merge branch 'icc-sar2130p' into icc-nextGeorgi Djakov
Add driver for the network of connects present on the SAR2130P platform. * icc-sar2130p dt-bindings: interconnect: qcom: document SAR2130P NoC interconnect: qcom: add support for SAR2130P Link: https://lore.kernel.org/r/20241018-sar2130p-icc-v2-0-c58c73dcd19d@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-11-05Merge branch 'icc-qcs615' into icc-nextGeorgi Djakov
Add interconnect dt-bindings and driver support for Qualcomm QCS615 SoC. * icc-qcs615 dt-bindings: interconnect: document the RPMh Network-On-Chip interconnect in QCS615 SoC interconnect: qcom: add QCS615 interconnect provider driver Link: https://lore.kernel.org/r/20240924143958.25-1-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22interconnect: qcom: add QCS8300 interconnect provider driverRaviteja Laggyshetty
Add driver for the Qualcomm interconnect buses found in QCS8300 based platforms. The topology consists of several NoCs that are controlled by a remote processor that collects the aggregated bandwidth for each master-slave pairs. Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com> Link: https://lore.kernel.org/r/20240910101013.3020-3-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22interconnect: qcom: add support for SAR2130PDmitry Baryshkov
Add driver for the interconnects as present on the Qualcomm SAR2130P platform. This is based on the msm-5.10 tree, tag KERNEL.PLATFORM.1.0.r4-00400-NEO.0. Co-developed-by: Odelu Kukatla <quic_okukatla@quicinc.com> Signed-off-by: Odelu Kukatla <quic_okukatla@quicinc.com> Reviewed-by: Neil Armstrong <neil.armstrong@linaro.org> Signed-off-by: Dmitry Baryshkov <dmitry.baryshkov@linaro.org> Link: https://lore.kernel.org/r/20241018-sar2130p-icc-v2-2-c58c73dcd19d@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-10-22interconnect: qcom: add QCS615 interconnect provider driverRaviteja Laggyshetty
Add driver for the Qualcomm interconnect buses found in QCS615 based platforms. The topology consists of several NoCs that are controlled by a remote processor that collects the aggregated bandwidth for each master-slave pairs. Signed-off-by: Raviteja Laggyshetty <quic_rlaggysh@quicinc.com> Link: https://lore.kernel.org/r/20240924143958.25-3-quic_rlaggysh@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-24interconnect: qcom: Add MSM8937 interconnect provider driverAdam Skladowski
Add driver for interconnect busses found in MSM8937 based platforms. The topology consists of four NoCs that are partially controlled by a RPM processor. Signed-off-by: Adam Skladowski <a39.skl@gmail.com> Link: https://lore.kernel.org/r/20240709102728.15349-5-a39.skl@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-08-23interconnect: qcom: Add MSM8976 interconnect provider driverAdam Skladowski
Add driver for interconnect busses found in MSM8976 based platforms. The topology consists of four NoCs that are partially controlled by a RPM processor. Signed-off-by: Adam Skladowski <a39.skl@gmail.com> Link: https://lore.kernel.org/r/20240709102728.15349-3-a39.skl@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-06-28interconnect: qcom: Add MSM8953 driverVladimir Lypak
Add driver for interconnect busses found in MSM8953 based platforms. The topology consists of four NoCs that are partially controlled by a RPM processor. Note that one of NoCs (System NoC) has a counterpart (System NoC MM) that is modelled as child device to avoid resource conflicts, since it uses same MMIO space for configuration. Signed-off-by: Vladimir Lypak <vladimir.lypak@gmail.com> Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org> Signed-off-by: Barnabás Czémán <barnabas.czeman@mainlining.org> Link: https://lore.kernel.org/r/20240628-msm8953-interconnect-v3-2-a70d582182dc@mainlining.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-02-29Merge branch 'icc-sm7150' into icc-nextGeorgi Djakov
Add dt-bindings and interconnect driver support for the Qualcomm SM7150 SoC. * icc-sm7150 dt-bindings: interconnect: Add Qualcomm SM7150 DT bindings interconnect: qcom: Add SM7150 driver support Link: https://lore.kernel.org/r/20240222174250.80493-1-danila@jiaxyga.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-02-29interconnect: qcom: Add SM7150 driver supportDanila Tikhonov
Add a driver that handles the different NoCs found on SM7150, based on the downstream dtb. Signed-off-by: Danila Tikhonov <danila@jiaxyga.com> Link: https://lore.kernel.org/r/20240222174250.80493-3-danila@jiaxyga.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2024-01-31interconnect: qcom: Add MSM8909 interconnect provider driverAdam Skladowski
Add driver for interconnect busses found in MSM8909 based platforms. The topology consists of three NoCs that are partially controlled by a RPM processor. In the downstream/vendor kernel from Qualcomm there is an additional "mm-snoc". However, it actually ends up using the same RPM "snoc_clk" as the normal "snoc". It looks like this is actually the same NoC in hardware and the "mm-snoc" was only defined to assign a different "qcom,util-fact" to increase bandwidth requests by a static margin. In mainline we can represent this by assigning the equivalent "ab_coeff" to all the nodes that are part of "mm-snoc" downstream. Signed-off-by: Adam Skladowski <a39.skl@gmail.com> [Stephan: Drop separate mm-snoc that exists downstream since it's actually the same NoC as SNoC in hardware, add qos_offset for BIMC, add ab_coeff for mm-snoc nodes and BIMC] Signed-off-by: Stephan Gerhold <stephan.gerhold@kernkonzept.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Link: https://lore.kernel.org/r/20231220-icc-msm8909-v2-2-3b68bbed2891@kernkonzept.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-12-15Merge branch 'icc-sm6115' into icc-nextGeorgi Djakov
Add DT bindings and a driver for managing NoC providers on SM6115. * icc-sm6115 dt-bindings: interconnect: Add Qualcomm SM6115 NoC interconnect: qcom: Add SM6115 interconnect provider driver dt-bindings: interconnect: qcom,msm8998-bwmon: Add SM6115 bwmon instance interconnect: qcom: sm6115: Fix up includes Link: https://lore.kernel.org/r/20231125-topic-6115icc-v3-2-bd8907b8cfd7@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-12-06interconnect: qcom: Add SM6115 interconnect provider driverKonrad Dybcio
Add a driver for managing NoC providers on SM6115. Signed-off-by: Konrad Dybcio <konrad.dybcio@linaro.org> Link: https://lore.kernel.org/r/20231125-topic-6115icc-v3-2-bd8907b8cfd7@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-11-24Merge branch 'icc-x1e80100' into icc-nextGeorgi Djakov
* icc-x1e80100 dt-bindings: interconnect: document the RPMh Network-On-Chip Interconnect in Qualcomm SM8650 SoC interconnect: qcom: introduce RPMh Network-On-Chip Interconnect on SM8650 SoC dt-bindings: interconnect: qcom-bwmon: document SM8650 BWMONs This series adds interconnect support for the Qualcomm X1E80100 platform, aka Snapdragon X Elite. Our v1 post of the patchsets adding support for Snapdragon X Elite SoC had the part number sc8380xp which is now updated to the new part number x1e80100 based on the new branding scheme and refers to the exact same SoC. Release Link: https://www.qualcomm.com/news/releases/2023/10/qualcomm-unleashes-snapdragon-x-elite--the-ai-super-charged-plat Link: https://lore.kernel.org/r/20231123135028.29433-1-quic_sibis@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-11-24interconnect: qcom: Add X1E80100 interconnect provider driverRajendra Nayak
Add driver for the Qualcomm interconnect buses found in X1E80100 based platforms. The topology consists of several NoCs that are controlled by a remote processor that collects the aggregated bandwidth for each master-slave pairs. Co-developed-by: Abel Vesa <abel.vesa@linaro.org> Signed-off-by: Abel Vesa <abel.vesa@linaro.org> Signed-off-by: Rajendra Nayak <quic_rjendra@quicinc.com> Co-developed-by: Sibi Sankar <quic_sibis@quicinc.com> Signed-off-by: Sibi Sankar <quic_sibis@quicinc.com> Link: https://lore.kernel.org/r/20231123135028.29433-3-quic_sibis@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-11-24interconnect: qcom: introduce RPMh Network-On-Chip Interconnect on SM8650 SoCNeil Armstrong
Add RPMh Network-On-Chip Interconnect support for the SM8650 platform. Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org> Link: https://lore.kernel.org/r/20231123-topic-sm8650-upstream-interconnect-v2-2-7e050874f59b@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-10-10interconnect: qcom: Add SDX75 interconnect provider driverRohit Agarwal
Add driver for the Qualcomm interconnect buses found in SDX75. Signed-off-by: Rohit Agarwal <quic_rohiagar@quicinc.com> Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Link: https://lore.kernel.org/r/1694614256-24109-3-git-send-email-quic_rohiagar@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-03-20interconnect: qcom: Drop obsolete dependency on COMPILE_TESTJean Delvare
Since commit 0166dc11be91 ("of: make CONFIG_OF user selectable"), it is possible to test-build any driver which depends on OF on any architecture by explicitly selecting OF. Therefore depending on COMPILE_TEST as an alternative is no longer needed. Signed-off-by: Jean Delvare <jdelvare@suse.de> Cc: Andy Gross <agross@kernel.org> Cc: Bjorn Andersson <andersson@kernel.org> Cc: Konrad Dybcio <konrad.dybcio@somainline.org> Cc: Georgi Djakov <djakov@kernel.org> Link: https://lore.kernel.org/r/20230209101310.11942cd0@endymion.delvare Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-02-06Merge branch 'icc-sa8775p' into icc-nextGeorgi Djakov
* icc-sa8775p dt-bindings: interconnect: qcom: document the interconnects for sa8775p interconnect: qcom: add a driver for sa8775p dt-bindings: interconnect: qcom,sa8775p-rpmh: fix a typo Link: https://lore.kernel.org/r/20230118140825.242544-2-brgl@bgdev.pl Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-02-06Merge branch 'icc-sdm670' into icc-nextGeorgi Djakov
* icc-sdm670 dt-bindings: interconnect: add sdm670 interconnects interconnect: qcom: add sdm670 interconnects Link: https://lore.kernel.org/r/20230111005155.50452-1-mailingradian@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-01-19interconnect: qcom: add a driver for sa8775pShazad Hussain
Introduce QTI SA8775P-specific interconnect driver. Signed-off-by: Shazad Hussain <quic_shazhuss@quicinc.com> [Bartosz: made the driver ready for upstream] Co-developed-by: Bartosz Golaszewski <bartosz.golaszewski@linaro.org> Signed-off-by: Bartosz Golaszewski <bartosz.golaszewski@linaro.org> Reviewed-by: Konrad Dybcio <konrad.dybcio@linaro.org> Link: https://lore.kernel.org/r/20230118140825.242544-1-brgl@bgdev.pl Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-01-19interconnect: qcom: add sdm670 interconnectsRichard Acayan
The interconnects for Snapdragon 670 can be controlled via RPMh. Add driver support for this. This driver was generated by the linux-interconnect-driver-generator and the virtual NoC's were merged with their parents. Link: https://git.sr.ht/~z3ntu/linux-interconnect-driver-generator Signed-off-by: Richard Acayan <mailingradian@gmail.com> Link: https://lore.kernel.org/r/20230111005155.50452-3-mailingradian@gmail.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-01-05Merge branch 'icc-qdu1000' into icc-nextGeorgi Djakov
Add dt bindings and driver support for the Qualcomm QDU1000 and QRU1000 SoCs. The Qualcomm Technologies, Inc. Distributed Unit 1000 and Radio Unit 1000 are new SoCs meant for enabling Open RAN solutions. See more at https://www.qualcomm.com/content/dam/qcomm-martech/dm-assets/documents/qualcomm_5g_ran_platforms_product_brief.pdf Link: https://lore.kernel.org/r/20221216230914.21771-1-quic_molvera@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2023-01-05interconnect: qcom: Add QDU1000/QRU1000 interconnect driverMelody Olvera
Add interconnect provider driver for Qualcomm QDU1000 and QRU1000 platforms. Signed-off-by: Melody Olvera <quic_molvera@quicinc.com> Link: https://lore.kernel.org/r/20221216230914.21771-3-quic_molvera@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-12-29interconnect: qcom: Add SM8550 interconnect provider driverAbel Vesa
Add driver for the Qualcomm interconnect buses found in SM8550 based platforms. The topology consists of several NoCs that are controlled by a remote processor that collects the aggregated bandwidth for each master-slave pairs. Signed-off-by: Abel Vesa <abel.vesa@linaro.org> Link: https://lore.kernel.org/r/20221202232054.2666830-3-abel.vesa@linaro.org Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-09-20interconnect: qcom: Kconfig: Make INTERCONNECT_QCOM tristateHuang Yiwei
Make INTERCONNECT_QCOM tristate so that icc-common.c can be compiled as a module. Signed-off-by: Huang Yiwei <quic_hyiwei@quicinc.com> Reviewed-by: Bjorn Andersson <andersson@kernel.org> Link: https://lore.kernel.org/r/20220914064122.16222-1-quic_hyiwei@quicinc.com Signed-off-by: Georgi Djakov <djakov@kernel.org>
2022-06-20interconnect: qcom: Add SM6350 driver supportLuca Weiss
Add a driver that handles the different NoCs found on SM6350, generated from the downstream dtb. We're exluding ALC, IP0 and all _display nodes. ALC will not be voted from the kernel[1] and IP0 is handled by the clk-rpmh driver[2]. [1] https://lore.kernel.org/linux-arm-msm/1e79c73f22c8891dc9f868babd940fca@codeaurora.org/ [2] https://lore.kernel.org/linux-arm-msm/20220412220033.1273607-1-swboyd@chromium.org/ Signed-off-by: Luca Weiss <luca.weiss@fairphone.com> Link: https://lore.kernel.org/r/20220525144404.200390-5-luca.weiss@fairphone.com Signed-off-by: Georgi Djakov <djakov@kernel.org>