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https://git.kernel.org/pub/scm/linux/kernel/git/robh/linux.git
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Add compatible string for tsens block found in MSM8952.
Signed-off-by: Muzaffer Kadir <muzafferkadir@mainlining.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20261011-msm8952-initial-support-v5-3-1857074992ec@mainlining.org
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The t7 thermal sensor needs a bus clock, in addition to the existing
functional clock, to gate register access to the sensor. This bus
clock is specific to each sensor, unlike the functional clock which
is shared between sensors. The current binding only describes a
single unnamed clock and therefore cannot represent this hardware
requirement, so add a second clock entry and clock-names for clarity.
Make the second clock mandatory for the t7-thermal compatible only,
via an additional if/then/else, to avoid breaking other Amlogic SoCs
that still use a single clock. Update the t7 example to match.
Fixes: b1c8ccdbd4e9 ("dt-bindings: thermal: amlogic: Add support for T7")
Signed-off-by: Ronald Claveau <linux-kernel-dev@aliel.fr>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260923-fix-t7-thermal-clock-v2-1-bff7a09eb487@aliel.fr
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Document the Thermal Management Unit (TMU) found on the Google GS101 SoC.
The GS101 TMU utilizes a hybrid control model shared between the
Application Processor (AP) and the ACPM (Alive Clock and Power Manager)
firmware. This hybrid ACPM TMU architecture is also present on other
Samsung Exynos SoCs (e.g., AutoV920, Exynos850).
While the TMU is a standard memory-mapped IP block, on this platform
the AP's direct register access is restricted to the interrupt pending
(INTPEND) registers for event identification. High-level functional
tasks, such as sensor initialization, threshold programming, and
temperature reads, are delegated to the ACPM firmware.
Signed-off-by: Tudor Ambarus <tudor.ambarus@linaro.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Reviewed-by: Peter Griffin <peter.griffin@linaro.org>
Link: https://patch.msgid.link/20260603-acpm-tmu-v8-1-0f1810a356e6@linaro.org
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Add the renesas,r9a08g046-tsu compatible string for the RZ/G3L Thermal
Sensor Unit (a.k.a TSU), which is similar to the RZ/G3S TSU but uses
different calibration constants. TSU is connected to a dedicated ADC IP
(a.k.a ADC1) on RZ/G3L.
Signed-off-by: Biju Das <biju.das.jz@bp.renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Jonathan Cameron <jonathan.cameron@oss.qualcomm.com>
Reviewed-by: Claudiu Beznea <claudiu.beznea.uj@bp.renesas.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://patch.msgid.link/20260925061617.127349-2-biju.das.jz@bp.renesas.com
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Document MBG temperature monitor on PMAU0102 which is programming-model
compatible with the one on PM8775.
Signed-off-by: Dhruvin Rajpura <drajpura@qti.qualcomm.com>
Signed-off-by: Shawn Guo <shengchao.guo@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Bartosz Golaszewski <bartosz.golaszewski@oss.qualcomm.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260830101025.191697-1-shengchao.guo@oss.qualcomm.com
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Convert Texas Instruments OMAP SCM bandgap from legacy text to DT schema
Add "ti,dra752-bandgap" to compatible which was missing in text binding
but used and matched by same driver.
Document the "#thermal-sensor-cells" property, which was missing from
the original text binding but is required in practice by all in-tree
users via the common thermal-sensor.yaml binding.
Signed-off-by: Bhargav Joshi <j.bhargav.u@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://patch.msgid.link/20260811-ti-bandgap-v2-1-6fec2a71c394@gmail.com
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Correct a few white-space issues around <>, which will be flagged by
dt-check-style. No functional changes.
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Acked-by: Mark Brown <broonie@kernel.org>
Reviewed-by: Luca Ceresoli <luca.ceresoli@bootlin.com>
Reviewed-by: Andy Shevchenko <andriy.shevchenko@intel.com>
Reviewed-by: Leo Yan <leo.yan@arm.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Acked-by: Lee Jones <lee@kernel.org>
Link: https://patch.msgid.link/20260826102044.142986-2-krzysztof.kozlowski@oss.qualcomm.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm
Pull more thermal control updates from Rafael Wysocki:
"This mostly consists of assorted updates of thermal drivers, including
new hardware support (Airoha AN7583, Qualcomm Master BandGap thermal
monitor, QCom PMIC5 Gen3 ADC), but it also includes two reverts of
recent cosmetic thermal core updates that went against driver core
plans to eliminate class_create():
- Fix missing bitfield include headers in Armada and QCom SPM BMG
drivers (Daniel Lezcano)
- Fix missed file when manually applying a change after a conflict
resolution for the QCom SPMI ADC TM5 Gen3 (Daniel Lezcano)
- Move thermal_zone_device_enable() to the right place in order to
prevent calling it if the thermal zone registration failed (Dan
Carpenter)
- Improve bitfield manipulations on Armada (Bryan B. Lima)
- Remove unneeded 'fast_io' on Sun8i and Armada (Wolfram Sang)
- Fix wrong boundary when clamping the low values in the set_trips()
callback and fix wrong mask when setting the temperature interval
on Airoha (Christian Marangi)
- Make use of the regmap API to support Airoha AN7583 (Christian
Marangi)
- Fix adc_tm5_get_temp() return check value on the QCom SPMI ADC
sensor (Rakesh Kota)
- Fix unbalanced clock enablement when the resume fails on the iMX
driver (Can Peng)
- Add Qualcomm Master BandGap thermal monitor support (Satya Priya
Kakitapalli)
- Add Maili Temperature bindings compatible (Haritha S K)
- Add a devm action to clean hardware interrupts, sampling, and
control registers on Spacemit K1 (Pei Xiao)
- Fix trivial typo in a thermal OF code comment (Marek Vasut)
- Remove unnecessary print on Qcom SPMI ADC driver when a call to
devm_request_threaded_irq() fails as this one already prints a
message (Jishnu Prakash)
- Add support for QCom PMIC5 Gen3 ADC by using auxiliary driver and
shared interrupt with the IIO driver (Jishnu Prakash)
- Make resets optional on MT8196 and add the corresponding property
in the DT bindings (AngeloGioacchino Del Regno)
- Fix clock staying enabled on failing resume operation on Qoriq (Can
Peng)
- Fix wrong closing brace position in thermal library header (Andreas
Haufler)
- Fix low and high trip point validation by moving the check after
the clamp on the spacemit driver (surendra)
- Remove redundant error messages on IRQ request failure (Pan Chuang)
- Add IIO_CONSUMER namespace import to the qcom-spmi-mbg-tm thermal
driver to avoid modpost warnings that would appear after merging
the iio tree against the thermal updates (Nathan Chancellor)
- Revert two recent cosmetic updates of the thermal core conflicting
with driver core plans to eliminate class_create() (Rafael
Wysocki)"
* tag 'thermal-7.3-rc1-2' of git://git.kernel.org/pub/scm/linux/kernel/git/rafael/linux-pm: (32 commits)
thermal/drivers/qcom-spmi-mbg-tm: Add module namespace import for IIO_CONSUMER
Revert "thermal/core: Allocate the thermal class dynamically"
Revert "thermal/core: Use the thermal class pointer as init guard"
thermal/drivers/armada: Fix missing bitfields include
thermal/drivers/qcom/spm mbg tm: Fix missing bitfield header
thermal/drivers/qcom: Fix missing spmi adc tm5 gen3 file
thermal/drivers: Remove redundant error messages on IRQ request failure
thermal/drivers/spacemit: Validate clamped trip thresholds
tools/lib/thermal: Fix misplaced extern "C" closing brace
thermal/drivers/qoriq: Disable clock on resume failure
thermal/drivers/mediatek/lvts_thermal: Make reset optional for MT8196
dt-bindings: thermal: mediatek: Make resets optional for MT8196
thermal/drivers/qcom: add support for PMIC5 Gen3 ADC thermal monitoring
iio: adc: qcom-spmi-adc5-gen3: Share SDAM0 IRQ with ADC_TM auxiliary driver
iio: adc: qcom-spmi-adc5-gen3: Remove an unnecessary print
thermal/of: Fix trivial enabled typo
thermal/drivers/spacemit/k1: Add shutdown action and reorder registration order
dt-bindings: thermal: qcom-tsens: Document the Maili Temperature Sensor
thermal/drivers/qcom: Add support for Qualcomm MBG thermal monitoring
dt-bindings: thermal: Add Qualcomm MBG thermal monitor support
...
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Both LVTS-AP and LVTS-MCU may be shared with SoC-internal MCUs
running some sort of firmware that checks thermals in order to
scale frequency, or to take action for critical SoC thermal
protection - and this is seen on most MT8196 boards.
Make resets optional, as doing a HW reset on such boards will
result in either an immediate thermal protect shutdown or in
a rather important and usually permanent system slowdown.
Signed-off-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Reviewed-by: Chen-Yu Tsai <wenst@chromium.org>
Link: https://patch.msgid.link/20260721105230.101906-2-angelogioacchino.delregno@collabora.com
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Document the Temperature Sensor (TSENS) on the Qualcomm Maili SoC.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Haritha S K <haritha.k@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Link: https://patch.msgid.link/20260619-b4-maili-upstream-3-v2-1-e54516c37022@oss.qualcomm.com
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Add bindings for the Qualcomm MBG (Master Bandgap) temperature alarm
peripheral found on the PM8775 PMIC. Unlike the existing SPMI temp alarm
peripheral, the MBG peripheral supports both hot and cold threshold
monitoring across two programmable levels (LVL1 and LVL2), with interrupt
status reported via a fault status register over SPMI.
Signed-off-by: Satya Priya Kakitapalli <quic_skakitap@quicinc.com>
Co-developed-by: Sachin Gupta <sachin.gupta@oss.qualcomm.com>
Signed-off-by: Sachin Gupta <sachin.gupta@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260722-spmi-mbg-driver-v3-1-ef73064f2789@oss.qualcomm.com
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There is no use of double colon '::' in YAML. OTOH, the literal style
block, e.g. using '|' treats all characters as content [1] therefore
single use of ':' in descriptions is perfectly fine, whenever '|' is
used.
Cleanup existing code, so the confusing style won't be re-used in new
contributions.
Link: https://yaml.org/spec/1.2.2/#literal-style [1]
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Acked-by: Alim Akhtar <alim.akhtar@samsung.com>
Acked-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Acked-by: Niklas Söderlund <niklas.soderlund+renesas@ragnatech.se>
Acked-by: Mark Brown <broonie@kernel.org>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be> # renesas
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Acked-by: Andi Shyti <andi.shyti@kernel.org>
Link: https://patch.msgid.link/20260623054842.21831-4-krzysztof.kozlowski@oss.qualcomm.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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The example DTS is tested in a wrapped node with address/size-cells=1,
thus reg had incorrect entry leading to dt_binding_check fails:
thermal/amlogic,thermal.example.dtb: temperature-sensor@20000 (amlogic,t7-thermal): reg: [[0, 131072], [0, 80]] is too long
Fixes: b1c8ccdbd4e9 ("dt-bindings: thermal: amlogic: Add support for T7")
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://patch.msgid.link/20260622100231.438435-4-krzysztof.kozlowski@oss.qualcomm.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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Usage of defines from headers requires including relevant header,
otherwise dt_binding_check fails:
Lexical error: Documentation/devicetree/bindings/thermal/amlogic,thermal.example.dts:59.27-34 Unexpected 'GIC_SPI'
Lexical error: Documentation/devicetree/bindings/thermal/amlogic,thermal.example.dts:59.38-57 Unexpected 'IRQ_TYPE_LEVEL_HIGH'
Lexical error: Documentation/devicetree/bindings/thermal/amlogic,thermal.example.dts:60.37-45 Unexpected 'CLKID_TS'
Fixes: b1c8ccdbd4e9 ("dt-bindings: thermal: amlogic: Add support for T7")
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://patch.msgid.link/20260622100231.438435-3-krzysztof.kozlowski@oss.qualcomm.com
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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Extend the thermal cooling device binding to support a 3 cells specifier
along with the 2 cells format.
Update #cooling-cells property to enum to support both 2 and 3 arguments.
Fix pwm-fan.yaml to restrict the number of cells to 'const: 2'
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Reviewed-by: Lukasz Luba <lukasz.luba@arm.com>
Acked-by: Rafael J. Wysocki (Intel) <rafael@kernel.org>
Link: https://patch.msgid.link/20260526140802.1059293-22-daniel.lezcano@oss.qualcomm.com
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Add i.MX93 compatible string 'fsl,imx93-tmu' because Thermal monitor
unit(TMU) on i.MX93 has differences with QorIQ platform and not fully
compatible with existing Platform, such as fsl,qoriq-tmu.
Signed-off-by: Jacky Bai <ping.bai@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Tested-by: Alexander Stein <alexander.stein@ew.tq-group.com>
Reviewed-by: Frank Li <Frank.Li@nxp.com>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20260430-imx93_tmu-v6-1-485459d7b54f@nxp.com
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Document the SpacemiT K1 Thermal Sensor, which supports
monitoring temperatures for five zones: soc, package, gpu, cluster0,
and cluster1.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Signed-off-by: Shuwei Wu <shuwei.wu@mailbox.org>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.or>
Link: https://patch.msgid.link/20260427-k1-thermal-v5-1-df39187480ed@mailbox.org
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Document the Temperature Sensor (TSENS) on the Qualcomm Hawi SoC.
Signed-off-by: Dipa Ramesh Mantre <dipa.mantre@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260512-dtbinding-hawi-v1-1-96149d06cccf@oss.qualcomm.com
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Document the Temperature Sensor (TSENS) on the Shikra SoC.
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260513-tsens_binding-v1-1-1780c6a6caf2@oss.qualcomm.com
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Add the amlogic,t7-thermal compatible for the Amlogic T7 thermal sensor.
Unlike existing variants which use a phandle to the ao-secure syscon,
the T7 relies on a secure monitor interface described by a phandle and
a sensor index argument.
The T7 integrates multiple thermal sensors, all accessed through the
same SMC call. The sensor index argument is required to identify which
sensor's calibration data the secure monitor should return, as a single
SM_THERMAL_CALIB_READ command serves all of them.
Introduce the amlogic,secure-monitor property as a phandle-array and
make amlogic,ao-secure or amlogic,secure-monitor conditionally required
depending on the compatible.
Signed-off-by: Ronald Claveau <linux-kernel-dev@aliel.fr>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://patch.msgid.link/20260424-add-thermal-t7-vim4-v5-1-9040ca36afe2@aliel.fr
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Document Temperature Sensor (TSENS) on Qualcomm Nord SoC.
Signed-off-by: Deepti Jaggi <deepti.jaggi@oss.qualcomm.com>
Signed-off-by: Shawn Guo <shengchao.guo@oss.qualcomm.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Pankaj Patil <pankaj.patil@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260504081236.825755-1-shengchao.guo@oss.qualcomm.com
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git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd
Pull MFD updates from Lee Jones:
"Core:
- Add a resource-managed version of alloc_workqueue()
(`devm_alloc_workqueue()`)
- Preserve the Open Firmware (OF) node when an ACPI handle
is present
Apple SMC:
- Wire up the Apple SMC power driver by adding a new MFD cell
Atmel HLCDC:
- Fetch the LVDS PLL clock as a fallback if the generic sys_clk
is unavailable
Broadcom BCM2835 PM:
- Add support for the BCM2712 power management device
- Introduce a hardware type identifier to distinguish SoC variants
Congatec CGBC, KEMPLD, RSMU, Si476x:
- Fix various kernel-doc warnings and correct struct member names
DLN2:
- Drop redundant USB device references and switch to managed
resource allocations
- Update bare 'unsigned' types to 'unsigned int'
ENE KB3930:
- Use the of_device_is_system_power_controller() wrapper
EZX PCAP:
- Avoid rescheduling after destroying the workqueue by switching
to a device-managed workqueue
- Drop redundant memory allocation error messages
- Return directly instead of using empty goto statements
Freescale i.MX25 TSADC:
- Convert devicetree bindings from TXT to YAML format
Freescale MC13xxx:
- Fix a memory leak in subdevice platform data allocation by
using devm_kmemdup()
Intel LPC ICH:
- Expose a software node for the GPIO controller cell to fix
GPIO lookups
Intel LPSS:
- Add PCI IDs for the Intel Nova Lake-H platform
Maxim MAX77620:
- Convert devicetree bindings from TXT to YAML format
- Document an optional I2C address for the MAX77663 RTC device
Maxim MAX77705:
- Make the max77705_pm_ops variable static to resolve a
sparse warning
MediaTek MT6397:
- Correct the hardware CIDs for the MT6328, MT6331, and MT6332
PMICs to allow proper driver binding
ROHM BD71828:
- Enable system wakeup via the power button
ROHM BD72720:
- Add a new compatible string for the ROHM BD73900 PMIC
SpacemiT P1:
- Drop the deprecated "vin-supply" property from the devicetree
bindings
- Add individual regulator supply properties to match actual
hardware topology
STMicroelectronics STPMIC1:
- Attempt system shutdown a second time to handle transient I2C
communication failures
Viperboard:
- Drop redundant USB device references"
* tag 'mfd-next-7.1' of git://git.kernel.org/pub/scm/linux/kernel/git/lee/mfd: (28 commits)
mfd: core: Preserve OF node when ACPI handle is present
mfd: ene-kb3930: Use of_device_is_system_power_controller() wrapper
mfd: intel-lpss: Add Intel Nova Lake-H PCI IDs
dt-bindings: mfd: max77620: Document optional RTC address for MAX77663
dt-bindings: mfd: max77620: Convert to DT schema
mfd: ezx-pcap: Avoid rescheduling after destroying workqueue
mfd: ezx-pcap: Return directly instead of empty gotos
mfd: ezx-pcap: Drop memory allocation error message
mfd: bcm2835-pm: Add BCM2712 PM device support
mfd: bcm2835-pm: Introduce SoC-specific type identifier
dt-bindings: mfd: bd72720: Add ROHM BD73900
mfd: si476x: Fix kernel-doc warnings
mfd: rsmu: Remove a empty kernel-doc line
mfd: kempld: Fix kernel-doc struct member names
mfd: congatec: Fix kernel-doc struct member names
dt-bindings: mfd: Convert fsl-imx25-tsadc.txt to yaml format
mfd: viperboard: Drop redundant device reference
mfd: dln2: Switch to managed resources and fix bare unsigned types
mfd: macsmc: Wire up Apple SMC power driver
mfd: mt6397: Properly fix CID of MT6328, MT6331 and MT6332
...
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT core:
- Cleanup of the reserved memory code to keep CMA specifics in CMA
code
- Add and convert several users to new of_machine_get_match() helper
- Validate nul termination in string properties
- Update dtc to upstream v1.7.2-69-g53373d135579
- Limit matching reserved memory devices to /reserved-memory nodes
- Fix some UAF in unittests
- Remove Baikal SoC bus driver
- Fix false DT_SPLIT_BINDING_PATCH checkpatch warning
- Allow fw_devlink device-tree on x86
- Fix kerneldoc return description for of_property_count_elems_of_size()
DT bindings:
- Add fsl,imx25-aips, fsl,imx25-tcq, qcom,eliza-pdc,
qcom,eliza-spmi-pmic-arb, qcom,hawi-imem, qcom,milos-imem,
qcom,hawi-pdc, and lg,sw49410 bindings
- Convert arm,vexpress-scc to DT schema
- Deprecate Qualcomm generic CPU compatibles. Add Apple M3 CPU cores.
- Move some dual-link display panels to the dual-link schema
- Drop mux controller node name constraints
- Remove Baikal SoC bus bindings
- Fix a false warning in the thermal trip node binding"
* tag 'devicetree-for-7.1' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (39 commits)
dt-bindings: display: panel: panel-simple: Add lg,sw49410 compatible
dt-bindings: display: ti, am65x-dss: Fix AM62L DSS reg and clock constraints
dt-bindings: display: simple: Move Innolux G156HCE-L01 panel to dual-link
dt-bindings: display: simple: Move AUO 21.5" FHD to dual-link
dt-bindings: thermal: Fix false warning with 'phandle' in trips nodes
of: unittest: fix use-after-free in testdrv_probe()
of: unittest: fix use-after-free in of_unittest_changeset()
dt-bindings: qcom,pdc: document the Hawi Power Domain Controller
dt-bindings: ARM: arm,vexpress-scc: convert to DT schema
drivers/of: fdt: validate flat DT string properties before string use
drivers/of: fdt: validate stdout-path properties before parsing them
dt-bindings: sram: Document qcom,hawi-imem compatible
dt-bindings: sram: Allow multiple-word prefixes to sram subnode
dt-bindings: sram: Document qcom,milos-imem
scripts/dtc: Update to upstream version v1.7.2-69-g53373d135579
of: property: Allow fw_devlink device-tree on x86
dt-bindings: arm: cpus: Add Apple M3 CPU core compatibles
dt-bindings: display: lt8912b: Drop redundant endpoint properties
dt-bindings: opp-v2: Fix example 3 CPU reg value
dt-bindings: connector: add pd-disable dependency
...
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A pattern property matching essentially anything doesn't work if there
are implicit properties such as 'phandle' which can occur on any node.
One such example popped up recently:
arch/arm64/boot/dts/qcom/sm8650-hdk.dtb: thermal-zones: gpuss0-thermal:trips:phandle: 531 is not of type 'object'
from schema $id: http://devicetree.org/schemas/thermal/thermal-zones.yaml
Instead of a pattern property, use an "additionalProperties" schema
instead which is the fallback in case of no matching property.
Link: https://patch.msgid.link/20260410223601.1487473-2-robh@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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Convert the SPEAr Thermal Sensor bindings to DT schema.
Signed-off-by: Gopi Krishna Menon <krishnagopi487@gmail.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Link: https://patch.msgid.link/20260329123449.309814-2-krishnagopi487@gmail.com
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Document the compatible for Qualcomm Eliza SoC TSENS module, fully
compatible with TSENS v2 generation (e.g. SM8650).
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Konrad Dybcio <konrad.dybcio@oss.qualcomm.com>
Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260327100733.365573-2-krzysztof.kozlowski@oss.qualcomm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Convert max77620 Device Tree bindings from TXT to YAML format. This patch
does not change any functionality; the bindings remain the same. The
thermal bindings are incorporated into the binding. GPIO controller
function in MAX77620 has no dedicated node and is folded into the parent
node itself.
Signed-off-by: Svyatoslav Ryhel <clamor95@gmail.com>
Acked-by: Daniel Lezcano <daniel.lezcano@kernel.org>
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://patch.msgid.link/20260312085258.11431-4-clamor95@gmail.com
Signed-off-by: Lee Jones <lee@kernel.org>
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Document the Temperature Sensor (TSENS) on the SM8750 SoC.
Signed-off-by: Manaf Meethalavalappu Pallikunhi <quic_manafm@quicinc.com>
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260313-sm8750_tsens-v1-1-250fcc3794a2@oss.qualcomm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Document the SDM670 LMh.
Signed-off-by: Richard Acayan <mailingradian@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260310002037.1863-3-mailingradian@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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Add the compatible for the thermal sensors on the SDM670.
Signed-off-by: Richard Acayan <mailingradian@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Link: https://patch.msgid.link/20260310002037.1863-2-mailingradian@gmail.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@kernel.org>
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The Renesas RZ/T2H (R9A09G077) and RZ/N2H (R9A09G087) SoCs include a
Temperature Sensor Unit (TSU). The device provides real-time temperature
measurements for thermal management, utilizing a single dedicated
channel for temperature sensing.
Compared to the previously supported RZ/G3E, the RZ/T2H and RZ/N2H SoCs
do not have a reset for the TSU peripheral, and the OTP data is exposed
via ARM SMC, as opposed to a system register.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Cosmin Tanislav <cosmin-gabriel.tanislav.xa@renesas.com>
Link: https://patch.msgid.link/20260108195223.193531-5-cosmin-gabriel.tanislav.xa@renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The Renesas RZ/V2N SoC includes a Thermal Sensor Unit (TSU) block designed
to measure the junction temperature. The device provides real-time
temperature measurements for thermal management, utilizing two dedicated
channels for temperature sensing.
The Renesas RZ/V2N SoC is using the same TSU IP found on the RZ/G3E SoC,
the only difference being that it has two channels instead of one.
Add new compatible string "renesas,r9a09g056-tsu" for RZ/V2N and use
"renesas,r9a09g047-tsu" as a fallback compatible to indicate hardware
compatibility with the RZ/G3E implementation.
Signed-off-by: Ovidiu Panait <ovidiu.panait.rb@renesas.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Link: https://patch.msgid.link/20251209091115.8541-2-ovidiu.panait.rb@renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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MT7987
Add thermal controller definition for MT7987.
Signed-off-by: Frank Wunderlich <frank-w@public-files.de>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://patch.msgid.link/20251223175710.25850-2-linux@fw-web.de
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Add LVTS thermal controller binding for MediaTek MT8196.
Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Tested-by: AngeloGioacchino Del Regno <angelogioacchino.delregno@collabora.com>
Tested-by: Frank Wunderlich <frank-w@public-files.de>
Signed-off-by: Laura Nao <laura.nao@collabora.com>
Link: https://patch.msgid.link/20251125-mt8196-lvts-v4-v5-1-6db7eb903fb7@collabora.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT bindings:
- Convert lattice,ice40-fpga-mgr, apm,xgene-storm-dma,
brcm,sr-thermal, amazon,al-thermal, brcm,ocotp, mt8173-mdp, Actions
Owl SPS, Marvell AP80x System Controller, Marvell CP110 System
Controller, cznic,moxtet, and apm,xgene-slimpro-mbox to DT schema
format
- Add i.MX95 fsl,irqsteer, MT8365 Mali Bifrost GPU, Anvo ANV32C81W
EEPROM, and Microchip pic64gx PLIC
- Add missing LGE, AMD Seattle, and APM X-Gene SoC platform
compatibles
- Updates to brcm,bcm2836-l1-intc, brcm,bcm2835-hvs, and bcm2711-hdmi
bindings to fix warnings on BCM2712 platforms
- Drop obsolete db8500-thermal.txt
- Treewide clean-up of extra blank lines and inconsistent quoting
- Ensure all .dtbo targets are applied to a base .dtb
- Speed up dt_binding_check by skipping running validation on empty
examples
DT core:
- Add of_machine_device_match() and of_machine_get_match_data()
helpers and convert users treewide
- Fix bounds checking of address properties in FDT code. Rework the
code to have a single implementation of the bounds checks.
- Rework of_irq_init() to ignore any implicit interrupt-parent (i.e.
in a parent node) on nodes without an interrupt. This matches the
spec description and fixes some RISC-V platforms.
- Avoid a spurious message on overlay removal
- Skip DT kunit tests on RISCV+ACPI"
* tag 'devicetree-for-6.19' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (55 commits)
dt-bindings: kbuild: Skip validating empty examples
dt-bindings: interrupt-controller: brcm,bcm2836-l1-intc: Drop interrupt-controller requirement
dt-bindings: display: Fix brcm,bcm2835-hvs bindings for BCM2712
dt-bindings: display: bcm2711-hdmi: Add interrupt details for BCM2712
of: Skip devicetree kunit tests when RISCV+ACPI doesn't populate root node
soc: tegra: Simplify with of_machine_device_match()
soc: qcom: ubwc: Simplify with of_machine_get_match_data()
powercap: dtpm: Simplify with of_machine_get_match_data()
platform: surface: Simplify with of_machine_get_match_data()
irqchip/atmel-aic: Simplify with of_machine_get_match_data()
firmware: qcom: scm: Simplify with of_machine_device_match()
cpuidle: big_little: Simplify with of_machine_device_match()
cpufreq: sun50i: Simplify with of_machine_device_match()
cpufreq: mediatek: Simplify with of_machine_get_match_data()
cpufreq: dt-platdev: Simplify with of_machine_get_match_data()
of: Add wrappers to match root node with OF device ID tables
dt-bindings: eeprom: at25: Add Anvo ANV32C81W
of/reserved_mem: Simplify the logic of __reserved_mem_alloc_size()
of/reserved_mem: Simplify the logic of fdt_scan_reserved_mem_reg_nodes()
of/reserved_mem: Simplify the logic of __reserved_mem_reserve_reg()
...
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Commit 1ee90870ce79 ("dt-bindings: thermal: tsens: Add QCS8300
compatible") uses a tab character which is illegal in YAML (at the
beginning of a line). The original patch was correct, so this got
corrupted when applied.
Fixes: 1ee90870ce79 ("dt-bindings: thermal: tsens: Add QCS8300 compatible")
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
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Add bindings documentation for i.MX91 thermal modules.
Signed-off-by: Pengfei Li <pengfei.li_1@nxp.com>
Signed-off-by: Frank Li <Frank.Li@nxp.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20251020-imx91tmu-v7-1-48d7d9f25055@nxp.com
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Add compatibility string for the thermal sensors on QCS8300 platform.
Signed-off-by: Gaurav Kohli <quic_gkohli@quicinc.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Reviewed-by: Akhil P Oommen <akhilpo@oss.qualcomm.com>
Link: https://patch.msgid.link/20250822042316.1762153-2-quic_gkohli@quicinc.com
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The tsens IP found in the IPQ5018 SoC should not use qcom,tsens-v1 as
fallback since it has no RPM and, as such, must deviate from the
standard v1 init routine as this version of tsens needs to be explicitly
reset and enabled in the driver.
So let's make qcom,ipq5018-tsens a standalone compatible in the bindings.
Fixes: 77c6d28192ef ("dt-bindings: thermal: qcom-tsens: Add ipq5018 compatible")
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Bjorn Andersson <andersson@kernel.org>
Signed-off-by: George Moussalem <george.moussalem@outlook.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://patch.msgid.link/20250818-ipq5018-tsens-fix-v1-1-0f08cf09182d@outlook.com
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The binding is already defined in mfd/stericsson,db8500-prcmu.yaml and none
of 'the tripN.*' properties appear to be in use.
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://patch.msgid.link/20251030195234.439141-1-robh@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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Convert the brcm,sr-thermal binding to DT schema format. It's a
straight-forward conversion. "polling-delay", "thermal-sensors", and
"temperature" all apply to the thermal zones, not the sensor node.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20251013215810.783006-1-robh@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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Convert amazon,al-thermal binding to DT schema format. It's a
straight-forward conversion.
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20251013215820.783272-1-robh@kernel.org
Signed-off-by: Rob Herring (Arm) <robh@kernel.org>
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Document the Temperature Sensor (TSENS) on the Kaanapali Platform.
Signed-off-by: Manaf Meethalavalappu Pallikunhi <manaf.pallikunhi@oss.qualcomm.com>
Signed-off-by: Jingyi Wang <jingyi.wang@oss.qualcomm.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20251021-b4-knp-tsens-v2-1-7b662e2e71b4@oss.qualcomm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The Renesas RZ/V2H SoC includes a Thermal Sensor Unit (TSU) block designed
to measure the junction temperature. The device provides real-time
temperature measurements for thermal management, utilizing two dedicated
channels for temperature sensing.
The Renesas RZ/V2H SoC is using the same TSU IP found on the RZ/G3E SoC,
the only difference being that it has two channels instead of one.
Add new compatible string "renesas,r9a09g057-tsu" for RZ/V2H and use
"renesas,r9a09g047-tsu" as a fallback compatible to indicate hardware
compatibility with the RZ/G3E implementation.
Signed-off-by: Ovidiu Panait <ovidiu.panait.rb@renesas.com>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Link: https://patch.msgid.link/20251020143107.13974-3-ovidiu.panait.rb@renesas.com
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull devicetree updates from Rob Herring:
"DT core:
- Update dtc to upstream version v1.7.2-35-g52f07dcca47c
- Add stub for of_get_next_child_with_prefix()
- Convert of_msi_map_id() callers to of_msi_xlate()
DT bindings:
- Convert multiple text board bindings to DT schema format
- Add bindings for synaptics,synaptics_i2c touchscreen controller,
innolux,n133hse-ea1 and nlt,nl12880bc20-spwg-24 displays, and NXP
vf610 reboot controller
- Add new Arm Cortex-A320/A520AE/A720AE and C1-Nano/Pro/Premium/Ultra
CPUs. Add missing Applied Micro CPU compatibles. Add pu-supply and
fsl,soc-operating-points properties for CPU nodes.
- Add QCom Glymur PDC and tegra264-agic interrupt controllers
- Add samsung,exynos8890-mali GPU to Arm Mali Midgard
- Drop Samsung S3C2410 display related bindings
- Allow separate DP lane and AUX connections in dp-connector
- Add some missing, undocumented vendor prefixes
- Add missing '#address-cells' properties in interrupt controller
bindings which dtc now warns about
- Drop duplicate socfpga-sdram-edac.txt, moxa,moxart-watchdog.txt,
fsl/mpic.txt, ti,opa362.txt, and cavium-thunder2.txt legacy text
bindings which are already covered by existing schemas.
- Various binding fixes for Mediatek platforms in mailbox, regulator,
pinctrl, timer, and display
- Drop work-around for yamllint quoting of values containing ','
- Various spelling, typo, grammar, and duplicated words fixes in DT
bindings and docs
- Add binding guidelines for defining properties at top level of
schemas, lack of node name ABI, and usage of simple-mfd"
* tag 'devicetree-for-6.18' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (81 commits)
dt-bindings: arm: altera: Drop socfpga-sdram-edac.txt
dt-bindings: gpu: Convert nvidia,gk20a to DT schema
dt-bindings: rng: sparc_sun_oracle_rng: convert to DT schema
dt-bindings: vendor-prefixes: update regex for properties without a prefix
dt-bindings: display: bridge: convert megachips-stdpxxxx-ge-b850v3-fw.txt to yaml
scripts: dt_to_config: fix grammar and a typo in --help text
dt-bindings: fix spelling, typos, grammar, duplicated words
docs: dt: fix grammar and spelling
of: base: Add of_get_next_child_with_prefix() stub
dt-bindings: trivial-devices: Add compatible string synaptics,synaptics_i2c
dt-bindings: soc: mediatek: pwrap: Add power-domains property
dt-bindings: pinctrl: mt65xx: Allow gpio-line-names
dt-bindings: media: Convert MediaTek mt8173-vpu bindings to DT schema
dt-bindings: arm: mediatek: Support mt8183-audiosys variant
dt-bindings: mailbox: mediatek,gce-mailbox: Make clock-names optional
dt-bindings: regulator: mediatek,mt6331: Add missing compatible
dt-bindings: regulator: mediatek,mt6331: Fix various regulator names
dt-bindings: regulator: mediatek,mt6332-regulator: Add missing compatible
dt-bindings: pinctrl: mediatek,mt7622-pinctrl: Add missing base reg
dt-bindings: pinctrl: mediatek,mt7622-pinctrl: Add missing pwm_ch7_2
...
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Document the Temperature Sensor (TSENS) on Glymur Platform.
Signed-off-by: Manaf Meethalavalappu Pallikunhi <quic_manafm@quicinc.com>
Signed-off-by: Pankaj Patil <pankaj.patil@oss.qualcomm.com>
Acked-by: Rob Herring (Arm) <robh@kernel.org>
Link: https://lore.kernel.org/r/20250920123631.281153-1-pankaj.patil@oss.qualcomm.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The Renesas RZ/G3E SoC includes a Thermal Sensor Unit (TSU) block designed
to measure the junction temperature. The device provides real-time
temperature measurements for thermal management, utilizing a single
dedicated channel (channel 1) for temperature sensing.
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Signed-off-by: John Madieu <john.madieu.xa@bp.renesas.com>
Link: https://lore.kernel.org/r/20250917170202.197929-2-john.madieu.xa@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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Instead of having an optional rockchip,grf property, forbid using it on
platforms without registers in a GRF being needed for thermal monitoring
and make it mandatory on the platforms actually needing it.
Signed-off-by: Sebastian Reichel <sebastian.reichel@collabora.com>
Reviewed-by: Dragan Simic <dsimic@manjaro.org>
Acked-by: Conor Dooley <conor.dooley@microchip.com>
Link: https://lore.kernel.org/r/20250820-thermal-rockchip-grf-warning-v2-3-c7e2d35017b8@kernel.org
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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The Renesas RZ/G3S SoC includes a Thermal Sensor Unit (TSU) block designed
to measure the junction temperature. The temperature is measured using
the RZ/G3S ADC, with a dedicated ADC channel directly connected to the TSU.
Add documentation for it.
Reviewed-by: Rob Herring (Arm) <robh@kernel.org>
Reviewed-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Claudiu Beznea <claudiu.beznea.uj@bp.renesas.com>
Tested-by: Wolfram Sang <wsa+renesas@sang-engineering.com>
Link: https://lore.kernel.org/r/20250810122125.792966-2-claudiu.beznea.uj@bp.renesas.com
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
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