dt-bindings: remoteproc: qcom,pas: add #cooling-cells property

Document the optional #cooling-cells property for Qualcomm PAS
remoteproc nodes so they can be used as thermal cooling devices via
the QMI Thermal Mitigation Device (TMD) interface.

Qualcomm remote processors expose TMD endpoints that support thermal
throttling through firmware. The cooling-device specifier uses 3 cells:

  <&phandle device_id min_state max_state>

where device_id selects the TMD endpoint (for example PA, modem, or
CDSP software mitigation), with constants defined in:
include/dt-bindings/thermal/qcom,pas.h

Example usage in a thermal zone:

  cooling-maps {
      map0 {
          trip = <&cpu_alert>;
          cooling-device = <&remoteproc_cdsp
                           QCOM_TMD_CDSP_SW
                           0 THERMAL_NO_LIMIT>;
      };
  };

Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@oss.qualcomm.com>
Acked-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20260809-b4-qmi-tmd-v8-1-b15d47adc379@oss.qualcomm.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>

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