remoteproc: qcom_q6v5_pas: enable QMI TMD cooling support

Enable Thermal Mitigation Device (TMD) support for PAS-managed CDSP and
modem remote processors on platforms that expose the QMI TMD service.

This adds per-platform TMD configuration in qcom_q6v5_pas for:
- Hamoa (X1E80100) CDSP
- Kodiak CDSP and modem
- Lemans (SA8775P) CDSP
- Talos CDSP
- Monaco CDSP

For each remoteproc, the configured TMD QMI instance ID is used to bind to
the TMD service running on that subsystem (e.g. CDSP: 0x43, modem: 0x0).
The driver then uses the corresponding TMD endpoint names ("cdsp_sw",
"pa", "modem") for cooling-device registration.

QMI TMD identifies mitigation endpoints by name, while DT thermal bindings
reference cooling devices by id. This change provides the mapping
between DT cooling indices and QMI TMD names, allowing remoteproc nodes
with #cooling-cells to act as cooling devices in the thermal framework.

With this in place, thermal policies can request mitigation from CDSP and
modem subsystems via QMI under thermal pressure.

Reviewed-by: Daniel Lezcano <daniel.lezcano@oss.qualcomm.com>
Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20260809-b4-qmi-tmd-v8-4-b15d47adc379@oss.qualcomm.com
Signed-off-by: Bjorn Andersson <andersson@kernel.org>

0 files changed, 0 insertions, 0 deletions