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Update licences format for core thermal files.
Signed-off-by: Lina Iyer <ilina@codeaurora.org>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This extends the sysfs interface for thermal cooling devices and exposes
some pretty useful statistics. These statistics have proven to be quite
useful specially while doing benchmarks related to the task scheduler,
where we want to make sure that nothing has disrupted the test,
specially the cooling device which may have put constraints on the CPUs.
The information exposed here tells us to what extent the CPUs were
constrained by the thermal framework.
The write-only "reset" file is used to reset the statistics.
The read-only "time_in_state_ms" file shows the time (in msec) spent by the
device in the respective cooling states, and it prints one line per
cooling state.
The read-only "total_trans" file shows single positive integer value
showing the total number of cooling state transitions the device has
gone through since the time the cooling device is registered or the time
when statistics were reset last.
The read-only "trans_table" file shows a two dimensional matrix, where
an entry <i,j> (row i, column j) represents the number of transitions
from State_i to State_j.
This is how the directory structure looks like for a single cooling
device:
$ ls -R /sys/class/thermal/cooling_device0/
/sys/class/thermal/cooling_device0/:
cur_state max_state power stats subsystem type uevent
/sys/class/thermal/cooling_device0/power:
autosuspend_delay_ms runtime_active_time runtime_suspended_time
control runtime_status
/sys/class/thermal/cooling_device0/stats:
reset time_in_state_ms total_trans trans_table
This is tested on ARM 64-bit Hisilicon hikey620 board running Ubuntu and
ARM 64-bit Hisilicon hikey960 board running Android.
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Here, prototype of thermal_zone_device_register is not matching
with static inline thermal_zone_device_register. One is using
const thermal_zone_params. Other is using non-const.
Signed-off-by: Arvind Yadav <arvind.yadav.cs@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Some BIOS implement ACPI notification code 0x83 to indicate active
relationship table(ART) and/or thermal relationship table(TRT) changes
to INT3400 device. This event needs to be propagated to user space so
that it can be handled by the user space thermal daemon.
Signed-off-by: Brian Bian <brian.bian@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The thermal core does not use the ability to look up pointers by ID, so
convert it from using an IDR to the more space-efficient IDA.
Signed-off-by: Matthew Wilcox <mawilcox@microsoft.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Finally, move the last thermal zone sysfs attributes to
tz->device.groups: trips attributes. This requires adding a
attribute_group to thermal_zone_device, creating it dynamically, and
then setting all trips attributes in it. The trips attribute is then
added to the tz->device.groups.
As the removal of all attributes are handled by device core, the device
remove calls are not needed anymore.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Added one additional parameter to thermal_zone_device_update() to provide
caller with an optional capability to specify reason.
Currently this event is used by user space governor to trigger different
processing based on event code. Also it saves an additional call to read
temperature when the event is received.
The following events are cuurently defined:
- Unspecified event
- New temperature sample
- Trip point violated
- Trip point changed
- thermal device up and down
- thermal device power capability changed
Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The .get_trend callback in struct thermal_zone_device_ops has
the prototype:
int (*get_trend) (struct thermal_zone_device *, int,
enum thermal_trend *);
whereas the .get_trend callback in struct thermal_zone_of_device_ops
has:
int (*get_trend)(void *, long *);
Streamline both prototypes and add the trip argument to the OF callback
aswell and use enum thermal_trend * instead of an integer pointer.
While the OF prototype may be the better one, this should be decided at
framework level and not on OF level.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch implements .set_trips for device tree thermal zones.
As the hardware-tracked trip points is supported by thermal core patch[0].
patch[0]
"thermal: Add support for hardware-tracked trip points".
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This adds support for hardware-tracked trip points to the device tree
thermal sensor framework.
The framework supports an arbitrary number of trip points. Whenever
the current temperature is updated, the trip points immediately
below and above the current temperature are found. A .set_trips
callback is then called with the temperatures. If there is no trip
point above or below the current temperature, the passed trip
temperature will be -INT_MAX or INT_MAX respectively. In this callback,
the driver should program the hardware such that it is notified
when either of these trip points are triggered. When a trip point
is triggered, the driver should call `thermal_zone_device_update'
for the respective thermal zone. This will cause the trip points
to be updated again.
If .set_trips is not implemented, the framework behaves as before.
This patch is based on an earlier version from Mikko Perttunen
<mikko.perttunen@kapsi.fi>
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Add apis for platform thermal drivers to query for slope and offset
attributes, which might be needed for temperature calculations.
Signed-off-by: Rajendra Nayak <rnayak@codeaurora.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Fixes commit 60f9ce3ada53
("thermal: of-thermal: allow setting trip_temp on hardware")
Signed-off-by: Caesar Wang <wxt@rock-chips.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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In current of-thermal, the .set_trip_temp only support to
set trip_temp for SW. But some sensors support to set
trip_temp on hardware, so that can trigger interrupt,
shutdown or any other events.
This patch adds .set_trip_temp() callback in
thermal_zone_of_device_ops{}, so that the sensor device can
use it to set trip_temp on hardware.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The commit 17e8351a7739 consistently use int for temperature,
however it missed a few in trip temperature and thermal_core.
In current codes, the trip->temperature used "unsigned long"
and zone->temperature used"int", if the temperature is negative
value, it will get wrong result when compare temperature with
trip temperature.
This patch can fix it.
Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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In some cases, platform thermal driver may report invalid trip points,
thermal core should not take any action for these trip points.
This fixed a regression that bogus trip point starts to screw up thermal
control on some Lenovo laptops, after
commit bb431ba26c5cd0a17c941ca6c3a195a3a6d5d461
Author: Zhang Rui <rui.zhang@intel.com>
Date: Fri Oct 30 16:31:47 2015 +0800
Thermal: initialize thermal zone device correctly
After thermal zone device registered, as we have not read any
temperature before, thus tz->temperature should not be 0,
which actually means 0C, and thermal trend is not available.
In this case, we need specially handling for the first
thermal_zone_device_update().
Both thermal core framework and step_wise governor is
enhanced to handle this. And since the step_wise governor
is the only one that uses trends, so it's the only thermal
governor that needs to be updated.
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Tested-by: Matthias <morpheusxyz123@yahoo.de>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
CC: <stable@vger.kernel.org> #3.18+
Link: https://bugzilla.redhat.com/show_bug.cgi?id=1317190
Link: https://bugzilla.kernel.org/show_bug.cgi?id=114551
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Add resource managed version of thermal_zone_of_sensor_register() and
thermal_zone_of_sensor_unregister().
This helps in reducing the code size in error path, remove of
driver remove callbacks and making proper sequence for deallocations.
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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When a new cooling device is registered, we need to update the
thermal zone to set the new registered cooling device to a proper
state.
This fixes a problem that the system is cool, while the fan devices
are left running on full speed after boot, if fan device is registered
after thermal zone device.
Here is the history of why current patch looks like this:
https://patchwork.kernel.org/patch/7273041/
CC: <stable@vger.kernel.org> #3.18+
Reference:https://bugzilla.kernel.org/show_bug.cgi?id=92431
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
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After thermal zone device registered, as we have not read any
temperature before, thus tz->temperature should not be 0,
which actually means 0C, and thermal trend is not available.
In this case, we need specially handling for the first
thermal_zone_device_update().
Both thermal core framework and step_wise governor is
enhanced to handle this. And since the step_wise governor
is the only one that uses trends, so it's the only thermal
governor that needs to be updated.
CC: <stable@vger.kernel.org> #3.18+
Tested-by: Manuel Krause <manuelkrause@netscape.net>
Tested-by: szegad <szegadlo@poczta.onet.pl>
Tested-by: prash <prash.n.rao@gmail.com>
Tested-by: amish <ammdispose-arch@yahoo.com>
Tested-by: Matthias <morpheusxyz123@yahoo.de>
Reviewed-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Chen Yu <yu.c.chen@intel.com>
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When the prototype for thermal_zone_bind_cooling_device
changed, the static inline wrapper function was left alone,
which in theory can cause build warnings:
I have seen this error in the past:
drivers/thermal/db8500_thermal.c: In function 'db8500_cdev_bind':
drivers/thermal/db8500_thermal.c:78:9: error: too many arguments to function 'thermal_zone_bind_cooling_device'
ret = thermal_zone_bind_cooling_device(thermal, i, cdev,
while this one no longer shows up, there is no doubt that
the prototype is still wrong, so let's just fix it anyway.
Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Fixes: 6cd9e9f629f1 ("thermal: of: fix cooling device weights in device tree")
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The macros KELVIN_TO_CELSIUS and CELSIUS_TO_KELVIN actually convert
between deciKelvins and Celsius, so rename them to reflect that. While
at it, use a statement expression in DECI_KELVIN_TO_CELSIUS to prevent
expanding the argument multiple times and get rid of a few casts.
Signed-off-by: Rasmus Villemoes <linux@rasmusvillemoes.dk>
Acked-by: Darren Hart <dvhart@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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The thermal core already has a function to get the maximum power of a
cooling device: power_actor_get_max_power(). Add a function to get the
minimum power of a cooling device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reviewed-by: Daniel Kurtz <djkurtz@chromium.org>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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thermal_zone_of_sensor_register is documented as returning a pointer
to either a valid thermal_zone_device on success, or a corresponding
ERR_PTR() value.
In contrast, the function returns NULL when THERMAL_OF is configured
off. Fix this.
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The thermal code uses int, long and unsigned long for temperatures
in different places.
Using an unsigned type limits the thermal framework to positive
temperatures without need. Also several drivers currently will report
temperatures near UINT_MAX for temperatures below 0°C. This will probably
immediately shut the machine down due to overtemperature if started below
0°C.
'long' is 64bit on several architectures. This is not needed since INT_MAX °mC
is above the melting point of all known materials.
Consistently use a plain 'int' for temperatures throughout the thermal code and
the drivers. This only changes the places in the drivers where the temperature
is passed around as pointer, when drivers internally use another type this is
not changed.
Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Reviewed-by: Jean Delvare <jdelvare@suse.de>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Reviewed-by: Darren Hart <dvhart@linux.intel.com>
Reviewed-by: Heiko Stuebner <heiko@sntech.de>
Reviewed-by: Peter Feuerer <peter@piie.net>
Cc: Punit Agrawal <punit.agrawal@arm.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: Jean Delvare <jdelvare@suse.de>
Cc: Peter Feuerer <peter@piie.net>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: Lukasz Majewski <l.majewski@samsung.com>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: linux-acpi@vger.kernel.org
Cc: platform-driver-x86@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-omap@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Maxime Ripard <maxime.ripard@free-electrons.com>
Cc: Darren Hart <dvhart@infradead.org>
Cc: lm-sensors@lm-sensors.org
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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It is common to have a linear extrapolation from
the current sensor readings and the actual temperature
value. This is specially the case when the sensor
is in use to extrapolate hotspots.
This patch adds slope and offset constants for
single sensor linear extrapolation equation. Because
the same sensor can be use in different locations,
from board to board, these constants are added
as part of thermal_zone_params.
The constants are available through sysfs.
It is up to the device driver to determine
the usage of these values.
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature. Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.
This governor relies on "power actors", entities that represent heat
sources. They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.
The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone. The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control. It decides how much power to give each cooling device based
on the performance they are requesting. The PID controller ensures
that the total power budget does not exceed the control temperature.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Add three optional callbacks to the cooling device interface to allow
them to express power. In addition to the callbacks, add helpers to
identify cooling devices that implement the power cooling device API.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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A governor may need to store its current state between calls to
throttle(). That state depends on the thermal zone, so store it as
private data in struct thermal_zone_device.
The governors may have two new ops: bind_to_tz() and unbind_from_tz().
When provided, these functions let governors do some initialization
and teardown when they are bound/unbound to a tz and possibly store that
information in the governor_data field of the struct
thermal_zone_device.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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The fair share governor has the concept of weights, which is the
influence of each cooling device in a thermal zone. The current
implementation forces the weights of all cooling devices in a thermal
zone to add up to a 100. This complicates setups, as you need to know
in advance how many cooling devices you are going to have. If you bind a
new cooling device, you have to modify all the other cooling devices
weights, which is error prone. Furthermore, you can't specify a
"default" weight for platforms since that default value depends on the
number of cooling devices in the platform.
This patch generalizes the concept of weight by allowing any number to
be a "weight". Weights are now relative to each other. Platforms that
don't specify weights get the same default value for all their cooling
devices, so all their cdevs are considered to be equally influential.
It's important to note that previous users of the weights don't need to
alter the code: percentages continue to work as they used to. This
patch just removes the constraint of all the weights in a thermal zone
having to add up to a 100. If they do, you get the same behavior as
before. If they don't, fair share now works for that platform.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Durgadoss R <durgadoss.r@intel.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be. The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.
Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.
While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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When CONFIG_THERMAL is not enabled, it is better to introduce
equivalent dummy functions in the exported header than to
introduce #ifdeffery in drivers using the function.
This will prevent issues such as that reported in:
http://www.spinics.net/lists/linux-next/msg31573.html
While at it switch over to IS_ENABLED for thermal macros
to allow for thermal framework to be built as framework
and relevant APIs be usable by relevant drivers as a result.
Reported-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc
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The size of unsigned long varies between 32 and 64 bit systems while
the size of phandle arguments is always 32 bits per parameter.
On 64-bit systems, cooling devices registered via of-thermal apis fail
to bind when the min/max cooling state is specified as
THERMAL_NO_LIMIT (-1UL) as there is a mis-match between the value read
from the device tree (32bit) and the pre-processor define (64bit).
As we're unlikely to need cooling states larger than 32 bits, and for
consistency with the size of phandle arguments, explicitly limit
THERMAL_NO_LIMIT to 32 bits.
Reported-by: Hyungwoo Yang <hwoo.yang@gmail.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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include/linux/thermal.h contains definitions for the Thermal generic
netlink family, but none of the valuable information relevant to
user-space such as the Genl family name, multicast group, version or
command set and data types is exported to user-space.
Export all the relevant generic netlink information to user-space to
make this genl family usable by user-space, and while at it, export
THERMAL_NAME_LENGTH since it limits name length for thermal_hwmon
devices.
Kbuild and MAINTAINERS are also updated accordingly to reflect this new
file: include/uapi/linux/thermal.h.
Signed-off-by: Florian Fainelli <f.fainelli@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Before this change it was only possible to set get_temp() and get_trend()
methods to be used in the common code handling passing parameters via
device tree to "cpu-thermal" CPU thermal zone device.
Now it is possible to also set emulated value of temperature for debug
purposes.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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This patch changes name of struct __thermal_trip to thermal_trip and moves
declaration of the latter to ./include/linux/thermal.h for better visibility.
Signed-off-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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Different drivers request API extensions in of-thermal. For this reason,
additional callbacks are required to fit the new drivers needs.
The current API implementation expects the registering sensor driver
to provide a get_temp and get_trend callbacks as function parameters.
As the amount of callbacks is growing, this patch changes the existing
implementation to use a .ops field to hold all the of thermal callbacks
to sensor drivers.
This patch also changes the existing of-thermal users to fit the new
API design. No functional change is introduced in this patch.
Cc: Alexandre Courbot <gnurou@gmail.com>
Cc: devicetree@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Jean Delvare <jdelvare@suse.de>
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-tegra@vger.kernel.org
Cc: lm-sensors@lm-sensors.org
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Tested-by: Mikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: Mikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: Alexandre Courbot <acourbot@nvidia.com>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
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ACPI INT3402 device object could report temperature for the memory module.
To expose such information to user space, a thermal zone device is registered
for it so that the thermal sysfs interface can expose such information for
userspace to use.
Signed-off-by: Aaron Lu <aaron.lu@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This macro can be used by other component so move it to a common header,
but in a slightly different way: define two macros, one macro with an
offset and the other doesn't.
Signed-off-by: Aaron Lu <aaron.lu@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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Document struct thermal_zone_device and struct thermal_governor fields
and their use by the thermal framework code.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch adds a new API to allow registering cooling devices
in the thermal framework derived from device tree nodes.
This API links the cooling device with the device tree node
so that binding with thermal zones is possible, given
that thermal zones are pointing to cooling device
device tree nodes.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.
This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.
This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.
Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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When registering a thermal zone device using platform information
via bind_params, the thermal framework will always perform the
cdev binding using the lowest and highest limits (THERMAL_NO_LIMIT).
This patch changes the data structures so that it is possible
to inform what are the desired limits for each trip point
inside a bind_param. The way the binding is performed is also
changed so that it uses the new data structure.
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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When registering a new thermal_device, the thermal framework
will always add a hwmon sysfs interface.
This patch adds a flag to make this behavior optional. Now
when registering a new thermal device, the caller can
optionally inform if hwmon interface is desirable. This can
be done by means of passing a thermal_zone_params.no_hwmon == true.
In order to keep same behavior as of today, all current
calls will by default create the hwmon interface.
Cc: David Woodhouse <dwmw2@infradead.org>
Cc: linux-acpi@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: Zhang Rui <rui.zhang@intel.com>
Suggested-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management update from Zhang Rui:
"The most important one is to build thermal core and governor and cpu
cooling code into one module. This fixes a regression that thermal
core does not work if it is built as module, since 3.7. I'll backport
them to stable kernel once those changes are in upstream.
The largest batch is the thermal kernel-doc & coding style
updates/cleanups from Eduardo.
Highlights:
- build all thermal framework code into one module to fix a
regression that thermal does not work if it is built as module.
- Marvell Armada 370/XP thermal sensor driver
- thermal core/cpu cooling kernel-doc & coding style updates and
cleanups.
- Add Eduardo Valentin as thermal sub-maintainer, both in mailing
list and patchwork. He will help me on arm thermal drivers."
* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (68 commits)
thermal: db8500_cpufreq_cooling: remove usage of IS_ERR_OR_NULL()
thermal: thermal_core: remove usage of IS_ERR_OR_NULL
thermal: cpu_cooling: improve line breaking
thermal: cpu_cooling: alignment improvements
thermal: cpu_cooling: remove checkpatch.pl warning
thermal: cpu_cooling: remove trailing blank line
thermal: cpu_cooling: align on open parenthesis
thermal: cpu_cooling: standardize comment style
thermal: cpu_cooling: standardize end of function
thermal: cpu_cooling: remove trailing white spaces
Thermal: update documentation for thermal_zone_device_register
thermal: update kernel-doc for thermal_zone_device_register
thermal: update kernel-doc for create_trip_attrs
thermal: update kernel-doc for thermal_cooling_device_register
thermal: update kernel-doc for thermal_zone_unbind_cooling_device
thermal: update kernel-doc for thermal_zone_bind_cooling_device
thermal: use EXPORT_SYMBOL_GPL
thermal: rename notify_thermal_framework to thermal_notify_framework
thermal: update driver license
thermal: use strlcpy instead of strcpy
...
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To follow the prefix names used by the thermal functions,
this patch renames notify_thermal_framework to thermal_notify_framework.
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch exports the thermal_zone_get_temp API so that driver
writers can fetch temperature of thermal zones managed by other
drivers.
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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This patch adds a helper function to get a reference of
a thermal zone, based on the zone type name.
It will perform a zone name lookup and return a reference
to a thermal zone device that matches the name requested.
In case the zone is not found or when several zones match
same name or if the required parameters are invalid, it will return
the corresponding error code (ERR_PTR).
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into next
Conflicts:
drivers/thermal/cpu_cooling.c
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The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.
Build them into one module in this patch.
This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
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