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Add OSM L3 interconnect provider binding on SC7180 SoCs.
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Sibi Sankar <sibis@codeaurora.org>
Link: https://lore.kernel.org/r/20200227105632.15041-5-sibis@codeaurora.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
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Add bindings for Operating State Manager (OSM) L3 interconnect provider
on SDM845 SoCs.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Sibi Sankar <sibis@codeaurora.org>
Link: https://lore.kernel.org/r/20200227105632.15041-3-sibis@codeaurora.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
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The Qualcomm SC7180 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.
Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/1583241493-21212-2-git-send-email-okukatla@codeaurora.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
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Redefine the Network-on-Chip devices to more accurately describe
the interconnect topology on Qualcomm's SDM845 platform. Each
interconnect device can communicate with different instances of the
RPMh hardware which are described as RSCs(Resource State Coordinators).
Signed-off-by: David Dai <daidavid1@codeaurora.org>
Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org>
Signed-off-by: Sibi Sankar <sibis@codeaurora.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20200209183411.17195-4-sibis@codeaurora.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
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Add YAML schemas for interconnect bcm-voters found on QCOM RPMh-based
SoCs.
Signed-off-by: David Dai <daidavid1@codeaurora.org>
Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org>
Signed-off-by: Sibi Sankar <sibis@codeaurora.org>
Acked-by: Rob Herring <robh@kernel.org>
Link: https://lore.kernel.org/r/20200209183411.17195-3-sibis@codeaurora.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
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Convert the qcom,sdm845 interconnect provider binding to DT schema.
Signed-off-by: David Dai <daidavid1@codeaurora.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Odelu Kukatla <okukatla@codeaurora.org>
Signed-off-by: Sibi Sankar <sibis@codeaurora.org>
Link: https://lore.kernel.org/r/20200209183411.17195-2-sibis@codeaurora.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
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The Qualcomm MSM8916 platform has several bus fabrics that could be
controlled and tuned dynamically according to the bandwidth demand.
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
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git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux
Pull Devicetree updates from Rob Herring:
- DT schemas for PWM, syscon, power domains, SRAM, syscon-reboot,
syscon-poweroff, renesas-irqc, simple-pm-bus, renesas-bsc, pwm-rcar,
Renesas tpu, at24 eeprom, rtc-sh, Allwinner PS/2, sharp,ld-d5116z01b
panel, Arm SMMU, max77650, Meson CEC, Amlogic canvas and DWC3 glue,
Allwinner A10 mUSB and CAN, TI Davinci MDIO, QCom QCS404
interconnect, Unisoc/Spreadtrum SoCs and UART
- Convert a bunch of Samsung bindings to DT schema
- Convert a bunch of ST stm32 bindings to DT schema
- Realtek and Exynos additions to Arm Mali bindings
- Fix schema errors in RiscV CPU schema
- Various schema fixes from improved meta-schema checks
- Improve the handling of 'dma-ranges' and in particular fix DMA mask
setup on PCI bridges
- Fix a memory leak in add_changeset_property() and DT unit tests.
- Several documentation improvements for schema validation
- Rework build rules to improve schema validation errors
- Color output for dtx_diff
* tag 'devicetree-for-5.5' of git://git.kernel.org/pub/scm/linux/kernel/git/robh/linux: (138 commits)
libfdt: define INT32_MAX and UINT32_MAX in libfdt_env.h
dt-bindings: arm: Remove leftover axentia.txt
of: unittest: fix memory leak in attach_node_and_children
of: overlay: add_changeset_property() memory leak
dt-bindings: interrupt-controller: arm,gic-v3: Add missing type to interrupt-partition-* nodes
dt-bindings: firmware: ixp4xx: Drop redundant minItems/maxItems
dt-bindings: power: Rename back power_domain.txt bindings to fix references
dt-bindings: i2c: stm32: Migrate i2c-stm32 documentation to yaml
dt-bindings: mtd: Convert stm32 fmc2-nand bindings to json-schema
dt-bindings: remoteproc: convert stm32-rproc to json-schema
dt-bindings: mailbox: convert stm32-ipcc to json-schema
dt-bindings: mfd: Convert stm32 low power timers bindings to json-schema
dt-bindings: interrupt-controller: Convert stm32-exti to json-schema
dt-bindings: crypto: Convert stm32 HASH bindings to json-schema
dt-bindings: rng: Convert stm32 RNG bindings to json-schema
dt-bindings: pwm: Convert Samsung PWM bindings to json-schema
dt-bindings: pwm: Convert PWM bindings to json-schema
dt-bindings: serial: Add a new compatible string for SC9863A
dt-bindings: serial: Convert sprd-uart to json-schema
dt-bindings: arm: Add bindings for Unisoc SC9863A
...
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Add device tree bindings for the Qualcomm MSM8974 interconnect providers
that support setting system bandwidth requirements between various
network-on-chip fabrics.
Signed-off-by: Brian Masney <masneyb@onstation.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Link: https://lore.kernel.org/r/20191024103054.9770-2-masneyb@onstation.org
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
Link: https://lore.kernel.org/r/20191108125349.24191-2-georgi.djakov@linaro.org
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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Convert the qcom,qcs404 interconnect provider binding to DT schema.
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
Signed-off-by: Rob Herring <robh@kernel.org>
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The Qualcomm QCS404 platform has several buses that could be controlled
and tuned according to the bandwidth demand.
Reviewed-by: Bjorn Andersson <bjorn.andersson@linaro.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
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The current DT bindings assume that the DMA will be performed by the
devices through their parent DT node, and rely on that assumption for the
address translation using dma-ranges.
However, some SoCs have devices that will perform DMA through another bus,
with separate address translation rules. We therefore need to express that
relationship, through the special interconnect name "dma-mem".
Acked-by: Georgi Djakov <georgi.djakov@linaro.org>
Signed-off-by: Maxime Ripard <maxime.ripard@bootlin.com>
Signed-off-by: Rob Herring <robh@kernel.org>
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Introduce Qualcomm SDM845 specific provider driver using the
interconnect framework.
Signed-off-by: David Dai <daidavid1@codeaurora.org>
Acked-by: Rob Herring <robh@kernel.org>
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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This binding is intended to represent the relations between interconnect
controllers (providers) and consumer device nodes. It will allow creating
links between consumers and interconnect paths (exposed by interconnect
providers).
Reviewed-by: Evan Green <evgreen@chromium.org>
Reviewed-by: Rob Herring <robh@kernel.org>
Signed-off-by: Georgi Djakov <georgi.djakov@linaro.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
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