summaryrefslogtreecommitdiff
path: root/tools/usb
diff options
context:
space:
mode:
authorIvan T. Ivanov <iivanov@mm-sol.com>2014-09-12 14:28:07 -0500
committerFelipe Balbi <balbi@ti.com>2014-09-12 15:43:48 -0500
commitd9152161b4bfd131a8253a5b9fcd8ba9b10277c4 (patch)
tree85a3099ad4ec5c20cce93501b5bc3a10c40c1c25 /tools/usb
parentbbfc6cb720df16b0c3895ac75c9804dd8c728ba4 (diff)
downloadlwn-d9152161b4bfd131a8253a5b9fcd8ba9b10277c4.tar.gz
lwn-d9152161b4bfd131a8253a5b9fcd8ba9b10277c4.zip
usb: dwc3: Add Qualcomm DWC3 glue layer driver
DWC3 glue layer is hardware layer around Synopsys DesignWare USB3 core. Its purpose is to supply Synopsys IP with required clocks, voltages and interface it with the rest of the SoC. Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com> Signed-off-by: Andy Gross <agross@codeaurora.org> Signed-off-by: Felipe Balbi <balbi@ti.com>
Diffstat (limited to 'tools/usb')
0 files changed, 0 insertions, 0 deletions